Main applications in the semiconductor industry
Encapsulation of epoxy resin
It applies to encapsulation of liquid epoxy resin in semiconductor industry. Void in the resin is shrunk and cured by pressure and heat. The method is used for especially in flip chip packages.
Since mold die is not required with this method, initial investment cost can be reduced and suitable for various package type and small lot production.
Void elimination of die bonding tape
Stack chip package design is very popular due to demand of big data processing. In process of stack chip bonding, void elimination between chip and bonding tape is quite important to prevent delamination and chip cracks.
Air compression is very effective to eliminate void since the void is compressed from all of the direction in the pressure vessel. Besides, high temperature process is available to cure the adhesion in the same process.