What is Autoclave void elimination system and Automatic cure system?
Auto clave void elimination system is to eliminate, disperse or minimize void occuring in film lamination process, resin pasting process, and many other kinds of void problems.
In general, everybody associates vacuum is effective for void elimination, however, void can’t be exhausted from high density liquid, and it rather causes foaming problems.
For example, vacuum after film lamination is not effective since void is surrounded by film. Void tends to be enlarged because of vacuum, and film is peeled from objects in worst case.
We propose air compression method for solution of the problems.
Besides, our system has heating function to enables mold encapsulation. With this method, investment cost for expensive mold die is not required. It is suitable for small lot production, R&D, and trial production.
Our system is used for various process in LCD, touch panel, semiconductor industries and has been expanding the scope of application.