Automatic processing by high temperature and high pressure.
1) It has a mode to set various high temperature and pressure program, arbitrarily.
2) It is possible to cope with various air void problems such as LED, organic EL, CFRP, void elimination after thick films adhesion, or difficult glasses adhesion.
3) Besides higher temperature, high pressure, larger sized systems are optionally available.
■ Simultaneous operation of pressurizing process and heating process
■Step operation (16 steps x 64 patterns) arbitral set temperature, pressure and time for delicate conditions.
■ Processing status displayed with digit and graph on the touch panel.
■Compering with our conventional products, it enables processing at higher temperature and higher pressure (standard 160 degree and 0.8 MPa.)
|Outer dimension（mm）||700W×1270H×785D (Including door and casters)|
|Effective internal dimension（mm）||Ø200×D280|
|Regular pressure range||0.05〜0.80MPaG|
|Regular temperature range||+20℃〜160℃|
|Power||100 VAC Single phase 1kVA|
|Necessary Air supply||More than 0.9MPa|
|Pressure vessel standard||Pressure vessel of class 2|
-Void elimination after the bonding steps
– Thermal cure of resins
– Liquid impregnation
– Applicable to a wide range of applications