It eliminates air void occurred in the pasting process, by temperature and pressure control after setting the object in the chamber.
It is applicable to production test of touch panels used for smartphones & tablets, improvement of film substrate adhesion and various applications related to air void elimination.
– Out original air circulation mechanism of the chamber is superior to sealing performance and create ideal compression environment realizes improvement of accurate air void elimination and improvement of film adhesion.
– Inside the chamber is all stainless and reduces risk of corrosion.
|Outer dimension (mm)||800W×1,535H×1,200D|
|Internal dimension of chamber (mm)||Ø550×D565|
|Regular pressure range||0.1〜0.5MPaG|
|Regular temperature range||Room temperature +10℃〜80℃|
|Power (50/60Hz)||200 VAC single phase 15A|
|Necessary air supply||0.7～1.0MPaG|
|Pressure vessel standard||Ministry of Health, Labor and Welfare in Japan: Pressure vessel of class 2|